DF (55) 55 54 94 02 • Cuernavaca (777) 102 83 86
Síguenos en:
 |  |  |
(55) 55 54 94 02
Libros relacionados
 |
A Cien Años de la Relatividad General Peimbert Sierra, Manuel / Rodríguez Jorge, Luis Felipe Colegio Nacional |
 |
Engineering Principles In Everyday Life For Non-Engineers B. Niku, Saeed Morgan & Claypool Publishers |
|
New Prospects Of Integrating Low Substrate Temperatures With Scaling-Sustained D Shovon Ashraf, Nabil / Alam, Shawon / Alam, Mohaiminul Morgan & Claypool Publishers |
|
Advances In Refletctometric Sensing For Industrial Applications Cataldo, Andrea / de Benedetto, Egidio / Cannazza, Giuseppe Morgan & Claypool Publishers |
|
Título: Advanced Electronic Packaging (Ieee Press Series On Microelectronic Systems) | |
| Autor: Ulrich / Brown | Precio: $1716.00 | |
| Editorial: John Wiley & Sons Inc. | Año: 2006 | |
| Tema: Ingenieria, Fisica | Edición: 2ª | |
| Sinopsis | ISBN: 9780471466093 | |
| As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. | ||
Disponibilidad: Bajo pedido
ó
ó
Librería Bonilla SA de CV © Todos los derechos reservados. 2019
Última actualización: Jul 2019