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Título: Tribology In Chemical-Mechanical Planarization | |
| Autor: Liang Hong | Precio: $1820.00 | |
| Editorial: Taylor & Francis | Año: 2005 | |
| Tema: Quimica, Ingenieria, Mecanica | Edición: | |
| Sinopsis | ISBN: 0824725670 | |
| Tribology in Chemical presents a detailed account of the CMP process in a lenguage that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. | ||
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